ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip

资讯摘要

ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip EUV lithography is one of the most critical bottlenecks in building the most advanced AI chips. As ASML lines up its biggest customers behind its latest tech, China is trying to break its dependence on the Dutch company under Huawei's lead. ASML has won commitments from the leading chipmakers to adopt its newest production tech, according to a report from Bloomberg. Samsung plans to use the Dutch company's High-NA EUV lithography machines for high-volume manufacturing starting in 2028, and TSMC in 2030.

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2. ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip